掲載誌・講演会情報

題目 掲載誌・講演会 掲載・発表年
Recent Progress in Low Temperature Curable Photosensitive Dielectric 2017 International Conference on Electronics Packaging 2017
Low Temperature Curable PI/PBO for Advanced Packaging IMAPS 13th International Conference and Exhibition on Device Packaging 2017
Low Temperature Curable PI/PBO for Wafer Level Packaging The 14th Annual International Wafer Level Packaging Conference 2017
低温硬化ポジ型感光性樹脂の高溶解コントラスト化 第27回マイクロエレクトロニクスシンポジウム(MES2017)秋季大会 2017
Novel 200 deg. C Curable Positive Tone Poly(benzoxazole) Materials IEEE CPMT Symposium Japan 2016 2016
Low Stress, High Modulus, Photosensitive Polyimide Journal of Photopolymer Science and Technology 28(2), 215-218, 2015 2015
Improvement in Adhesion Strength of Positive-tone Photo-definable Poly(benzoxazole) Materials The 16th Symposium on Polymers for Microelectronics 2014
Development of Low CHE, Negative-tone, Photo-definable Polyimide for HDD Suspension IEEE CPMT Symposium Japan 2012 2012
Using permanent and temporary polyimide adhesives in 3D-TSV processing to avoid thin wafer handling Journal of Microelectronics and Electronic Packaging, 7, 214-219, 2012 2012
Improvement in Chemical Resistance of Positive-tone Photodefinable Poly(benzoxazole) Materials Journal of Photopolymer Science and Technology, 23(4), 477, 2012 2012
Development of A Photosensitive PBO with Improved Chemical Resistance The 15th Symposium on Polymers for Microelectronics 2012
半導体用ストレスバッファー材料の最新動向 日本ゴム協会誌 85(2), 40-45, 2012 2012
Ultra Low Temperature Curable Positive-tone Photodefinable Poly(benzoxazole)-II The 14th Symposium on Polymers for Microelectronics 2010
三次元パッケージ技術を施行した高耐熱ポリイミド接着剤と薄ウェーハハンドリングへの適用 電子情報通信学会誌C Vol. J95-C, No. 11, 477-482, 2010 2010